Passive damping solution to optical image stabilization for voice control motors

ABSTRACT

Passive dampers (e.g., a viscoelastic material such as a silicon gel) may be applied at one or more locations within an actuator module along wires suspending a moving component (an optics assembly) from a fixed component (e.g., a base of an actuator module). The passive dampers act to passively dampen the motion of the optics assembly on the XY plane within the actuator module during optical image stabilization (OIS) of the optics assembly when subjected to external excitation or disturbance, and may also provide Z (optical) axis damping and impact protection. Process control and automation manufacturing and assembly methods for an OIS voice coil motor (VCM) actuator module including passive dampers are described, as well as design elements that provide for the integrity and reliability of the passive dampers over the life cycle of the actuator module.

BACKGROUND

1. Technical Field

This disclosure relates generally to control of the motion of cameracomponents.

2. Description of the Related Art

The advent of small, mobile multipurpose devices such as smartphones andtablet or pad devices has resulted in a need for high-resolution, smallform factor cameras for integration in the devices. Some small formfactor cameras may incorporate optical image stabilization (OIS)mechanisms that may sense and react to external excitation ordisturbance by adjusting location of the optical lens on the X and/or Yaxis in an attempt to compensate for unwanted motion of the lens. Somesmall form factor cameras may incorporate an autofocus (AF) mechanismwhereby the object focal distance can be adjusted to focus an objectplane or field in front of the camera at an image plane to be capturedby an image sensor (also referred to herein as a photosensor). In somesuch autofocus mechanisms, the optical lens is moved as a single rigidbody along the optical axis (referred to as the Z axis) of the camera torefocus the camera. In addition, high image quality is easier to achievein small form factor cameras if lens motion along the optical axis isaccompanied by minimal parasitic motion in the other degrees of freedom,for example on the X and Y axes orthogonal to the optical (Z) axis ofthe camera. Thus, some small form factor cameras that include autofocusmechanisms may also incorporate optical image stabilization (OIS)mechanisms that may sense and react to external excitation ordisturbance by adjusting location of the optical lens on the X and/or Yaxis in an attempt to compensate for unwanted motion of the lens.

SUMMARY OF EMBODIMENTS

An apparatus for controlling motions of an optics component (e.g., alens or lens system) relative to an image sensor within a camera mayinclude an actuator mechanism for controlling the position of the opticscomponent relative to the image sensor along two axes (X, Y) orthogonalto the optical (Z) axis of the camera. The apparatus may be referred toherein as an actuator module. In some embodiments, an optics assemblythat includes the optics component and at least some components of theactuator mechanism may be suspended on a plurality of wires or beamsover a base of the actuator module, with the image sensor disposed at orbelow the base. Each suspension wire may be substantially parallel tothe optical axis. In at least some embodiments, the wires are capable ofbending deformations that allow the optics assembly to move in lineardirections orthogonal to the optical axis (i.e., on the XY plane). Theactuator mechanism may provide optical image stabilization (OIS) for thecamera, and in some embodiments may be implemented as a voice coil motor(VCM) actuator mechanism. The actuator module may, for example, be usedas or in a miniature or small form factor camera suitable for small,mobile multipurpose devices such as cell phones, smartphones, and pad ortablet devices. In at least some embodiments, the actuator module mayalso include a focusing mechanism for moving the optics component alongan optical (Z) axis within the optics assembly.

Embodiments of passive damping techniques for an actuator module thatincludes an optics assembly are described herein. In embodiments, apassive damping component (e.g., a gel such as a silicon gel, siliconegel (the two terms being used interchangeably herein), or othermaterial) may be applied at one or more locations within the actuatormodule along the suspension wires. The passive damping components may bereferred to herein as passive dampers. In some embodiments, thelocations where the passive dampers are applied may be within a magnetholder component of the optics assembly or other component suspended onthe plurality of wires from the fixed base component, where the magnetholder component is part of the actuator mechanism.

The application of the passive dampers at these locations, physicalproperties of the passive damping material (e.g., a silicon gel) such asviscoelasticity, and the contact of the passive dampers with a surfaceof the moving component (e.g., an optics assembly) and with a surface ofthe fixed component (e.g., a cover fixed to a base) may act to passivelydampen motion of the optics assembly on the XY plane within the actuatormodule during optical image stabilization (OIS) of the optics assemblywhen subjected to external excitation or disturbance. In someembodiments, the passive dampers may also provide damping and reduceimpact shock on the optics assembly. Further, this location of thepassive dampers may be a favorable design for process control andautomation during manufacturing and assembly of an OIS VCM actuatormodule. In addition, at least some embodiments may include designelements that provide for the integrity and reliability of the passivedamping material (e.g., damping gel) over the life cycle of the actuatormodule.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate motion of an optics component within anactuator module, according to at least some embodiments.

FIG. 2 illustrates instability of an optical image stabilization (OIS)voice coil motor (VCM) actuator under an external excitation ordisturbance that is equal to natural resonant frequency.

FIG. 3 illustrates stabilization of an OIS VCM actuator under anexternal excitation or disturbance that is equal to natural resonantfrequency using passive damping, according to at least some embodiments.

FIG. 4 illustrates a side view of an example actuator module that showspassive damping components (e.g., damping gel) disposed around aplurality of wires according to at least some embodiments.

FIG. 5 shows a top view of the actuator module of FIG. 8 with the coverremoved, and shows example locations for passive damping components(e.g., damping gel) disposed around a plurality of wires according to atleast some embodiments.

FIG. 6 shows an alternative location for passive damping components(e.g., damping gel) disposed around a plurality of wires according to atleast some embodiments.

FIGS. 7A through 7E graphically illustrate an example manufacturingprocess for an actuator module that may be used in a small form factorcamera, according to at least some embodiments.

FIGS. 8A through 8D graphically illustrate an example method for dampinggel application during a manufacturing process for an actuator module,according to at least some embodiments.

FIG. 9 is a flowchart of a method for manufacturing an actuator modulethat may be used in a small form factor camera, according to at leastsome embodiments.

FIG. 10 is a flowchart of a method for damping gel application during amanufacturing process, according to at least some embodiments.

FIG. 11 illustrates a block diagram of a portable multifunction devicewith a camera in accordance with some embodiments.

FIG. 12 depicts a portable multifunction device having a camera inaccordance with some embodiments.

FIG. 13 illustrates an example computer system configured to implementaspects of a system and method for camera control, according to someembodiments.

This specification includes references to “one embodiment” or “anembodiment.” The appearances of the phrases “in one embodiment” or “inan embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

“Comprising.” This term is open-ended. As used in the appended claims,this term does not foreclose additional structure or steps. Consider aclaim that recites: “An apparatus comprising one or more processor units. . . ” Such a claim does not foreclose the apparatus from includingadditional components (e.g., a network interface unit, graphicscircuitry, etc.).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” is used to connote structure by indicatingthat the units/circuits/components include structure (e.g., circuitry)that performs those task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. §112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configure to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

“First,” “Second,” etc. As used herein, these terms are used as labelsfor nouns that they precede, and do not imply any type of ordering(e.g., spatial, temporal, logical, etc.). For example, a buffer circuitmay be described herein as performing write operations for “first” and“second” values. The terms “first” and “second” do not necessarily implythat the first value must be written before the second value.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While in this case, B is a factor that affects the determination of A,such a phrase does not foreclose the determination of A from also beingbased on C. In other instances, A may be determined based solely on B.

DETAILED DESCRIPTION

An apparatus for controlling motions of an optics component relative toan image sensor within a camera may include an actuator mechanism forcontrolling the position of the optics component relative to the imagesensor along two axes (X, Y) orthogonal to the optical (Z) axis of thecamera. The apparatus may be referred to herein as an actuator module.In some embodiments, an optics assembly that includes the opticscomponent and that may also include at least some components of theactuator mechanism (e.g., magnets and/or coils) may be suspended on aplurality of wires or beams over a base of the actuator module, with theimage sensor disposed at or below the base. Each suspension wire may besubstantially parallel to the optical axis. In at least someembodiments, the wires are capable of bending deformations that allowthe optics assembly to move in linear directions orthogonal to theoptical axis (i.e., on the XY plane). The actuator mechanism may provideoptical image stabilization (OIS) for the camera, and in someembodiments may be implemented as a voice coil motor (VCM) actuatormechanism. The actuator module may, for example, be used as or in aminiature or small form factor camera suitable for small, mobilemultipurpose devices such as cell phones, smartphones, and pad or tabletdevices. In at least some embodiments, the actuator module may alsoinclude a focusing mechanism for moving the optics component along anoptical (Z) axis within the optics assembly.

In some embodiments of passive damping techniques for an actuator modulethat includes an optics assembly as described herein, a passive dampingcomponent (e.g., a gel such as a silicon gel, or other material) may beapplied at one or more locations within the actuator module. The passivedamping components may be referred to herein as passive dampers. In someembodiments, a passive damper is a damper without moving structures asparts, such as an uncontrolled damper, which requires no input power tooperate. Some embodiments include an optics assembly including an opticscomponent. In some embodiments, the optics assembly is configured tomove within the apparatus on one or more axes orthogonal to an opticalaxis of the optics component. In some embodiments, the optics assemblyis suspended by a plurality of wires on a base component of theapparatus, each wire being substantially parallel to the optical axis ofthe optics component. In some embodiments, one or more passive dampersare disposed around the plurality of wires, wherein the passive dampersare configured to passively dampen motions of the optics assembly withinthe apparatus.

In some embodiments, the optics assembly includes a pocket, step,cavity, or indentation at each passive damper location that isconfigured to contain material of the passive damper duringdisplacement. In some embodiments, a component of the optics assemblyincludes a through-pipe cavity at each passive damper location that isconfigured to contain material of the passive damper during displacementand allow passage of one of the plurality of wires.

In some embodiments, a component of the optics assembly includes au-shaped cavity indentation open on one side and both ends at eachpassive damper location that is configured to contain material of thepassive damper during displacement and allow passage of one of theplurality of wires. In some embodiments, the optics assembly includes amagnet holder having a pocket, step, cavity, or indentation at eachpassive damper location that is configured to contain material of thepassive damper during displacement.

In some embodiments, the optics assembly includes an optics holderhaving a pocket, step, cavity, or indentation at each passive damperlocation that is configured to contain material of the passive damperduring displacement. In some embodiments, the optics assembly includes acoil holder having a pocket, step, cavity, or indentation at eachpassive damper location that is configured to contain material of thepassive damper during displacement.

In some embodiments, the fixed component is a cover coupled to the basecomponent.

In some embodiments, the optics assembly includes a pocket, step,cavity, or indentation at each passive damper location that areconfigured to contain material of the passive damper duringdisplacement.

In some embodiments, each passive damper is composed of a viscoelasticgel material that contacts an inner surface of the optics assembly andone of the plurality of wires to provide passive damping to motions ofthe optics assembly within the apparatus.

In some embodiments, the viscoelastic material is a silicon gel. In someembodiments, the viscoelastic material is a silicone gel. In someembodiments, the optics assembly further includes an actuator component.In some embodiments, the actuator component is coupled to the opticscomponent by one or more springs that provide optical (Z) axis movementto the optics component relative to the actuator component, and whereinthe passive dampers are disposed between an inner surface of the opticsassembly and one of the plurality of wires to provide passive damping tomotions of the optics assembly within the apparatus.

Some embodiments of passive damping techniques include a method forapplying passive damping. In some embodiments, the method includesassembling a base assembly for an optical image stabilization (OIS)voice coil motor (VCM) actuator module, and assembling an opticsassembly for the OIS VCM actuator module. In some embodiments, theoptics assembly is configured to move within the actuator module on oneor more axes orthogonal to an optical axis of an optics component. Insome embodiments. In some embodiments, the method further includessuspending the optics assembly by a plurality of wires connecting to thebase assembly of the actuator module, each wire being substantiallyparallel to the optical axis of the optics component. In someembodiments, the method further includes applying a passive dampingmaterial at one or more locations disposed around the plurality of wiressuspending the optics assembly. In some embodiments, the passive dampingmaterial is configured to apply passive damping to motions of the opticsassembly within the OIS VCM actuator module.

In some embodiments, the applying the passive damping material at one ormore locations disposed around the plurality of wires suspending theoptics assembly further includes applying the passive damping materialat one or more locations, each of said locations including a step,cavity, or indentation at each passive damper location that isconfigured to contain material of the passive damper duringdisplacement.

In some embodiments, the applying a passive damping material at one ormore locations on a top surface of the optics assembly includesdispensing the passive damping material at the one or more locationsdisposed around the plurality of wires, performing an automated opticalinspection (AOI) to determine if the passive damping material isproperly positioned at the locations disposed around the plurality ofwires and to determine that the extent of the material that wasdispensed at the locations is within pre-determined boundaries, curingthe passive damping material that was deposited at the one or morelocations on the top surface of the optics assembly, and performing anautomated optical inspection (AOI) profile scan to determine if thecured passive damping material at the one or more locations is within aheight H tolerance and within a diameter D tolerance.

In some embodiments, the passive damping material is a silicon gel, andthe curing is performed by application of ultraviolet (UV) light to thesilicon gel. In some embodiments, the passive damping material is asilicone gel, and wherein the curing is performed by application ofultraviolet (UV) light to the silicone gel. In some embodiments, theoptics assembly includes an actuator magnet component and an opticscomponent, and the actuator magnet component is coupled to the opticscomponent by one or more springs that provide optical (Z) axis movementto the optics component relative to the actuator magnet component.

Some embodiments include a camera. In some embodiments, the cameraincludes a photosensor configured to capture light projected onto asurface of the photosensor. In some embodiments, the camera includes anactuator module. In some embodiments, the actuator module includes anoptics assembly configured to refract light from an object field locatedin front of the camera onto the photosensor. In some embodiments, theactuator module includes an optical image stabilization (OIS) mechanismconfigured to move the optics assembly within the actuator module on oneor more axes orthogonal to an optical axis of the camera to stabilize animage plane formed by the optics assembly at the photosensor, In someembodiments, the optics assembly is suspended by a plurality of wires ona base component of the mechanism, each wire being substantiallyparallel to the optical axis of the optics component. In someembodiments, one or more passive dampers are disposed around theplurality of wires. In some embodiments, the passive dampers areconfigured to passively dampen motions of the optics assembly within theapparatus. In some embodiments, the passive dampers are configured topassively dampen movements of the optics assembly by the OIS mechanism.

In some embodiments, the OIS mechanism is a voice coil motor (VCM)technology actuator. In some embodiments, each passive damper iscomposed of a viscoelastic gel material that contacts an inner surfaceof the optics assembly and one of the plurality of wires to providepassive damping to motions of the optics assembly within the apparatus.

However, one of skill in the art will readily understand in light ofhaving read the present disclosure that passive dampers as describedherein may be applied at one or more other locations within an actuatormodule as described herein instead of or in addition to locationsdisposed about the plurality of wires. For example, in some embodiments,additional passive dampers may be located at the top of the movingassembly between the moving assembly and the fixed component (e.g., acover attached to a base of the actuator module), and passive dampersmay be located at the bottom of the moving assembly between the movingassembly and the fixed component (e.g., the base of the actuatormodule). In at least some embodiments, the locations where theadditional passive dampers are applied within the actuator module are atthe top of a moving component of the actuator module (e.g., the opticsassembly), between the moving component and a fixed component of theactuator module (e.g., a cover attached to a base of the actuatormodule). In some embodiments, the locations where the additional passivedampers are applied may be between a magnet holder component of theoptics assembly and the fixed component, where the magnet holdercomponent is part of the actuator mechanism.

In some embodiments, the application of the passive dampers at theselocations, physical properties of the passive damping material (e.g., asilicon gel) such as viscoelasticity, and the contact of the passivedampers with a surface of the moving component (e.g., an opticsassembly) and with a surface of the fixed component (cover) act topassively dampen motion of the optics assembly on the XY plane withinthe actuator module during optical image stabilization (OIS) of theoptics assembly when subjected to external excitation or disturbance.

In some embodiments, the passive dampers (e.g., damping gel) disposedaround the plurality of wires also act as a damper or “shock absorber”to improve reliability, damping acceleration and reducing impact shockof the suspended mechanism (the optics assembly) within the actuatormodule.

In addition, at least some embodiments may include design elements thatprovide for the integrity and reliability of the passive dampingmaterial (e.g., damping gel) over the life cycle of the actuator module.

Passive Damping for Optical Image Stabilization

FIGS. 1A and 1B illustrate motion of an optics component 1002 within anactuator module 1000, according to at least some embodiments. As shownin FIG. 1A, an actuator module 1000 may provide optical imagestabilization (OIS) for the optics component 1002. In at least someembodiments, the actuator module 1000 may implement a voice coil motor(VCM) actuator mechanism. An actuator module 1000 such as an OIS VCMactuator module may provide motion to optics component 1002 in the XYplane. In addition, in some embodiments, motion may also be provided tooptics component 1002 on the Z (optical) axis, for example by a focusingmechanism of the actuator module 1000 for moving the optics component1002 along the optical (Z) axis within the actuator module 1000. The XYplane motion is, for example, for optical image stabilization (OIS)relative to a photosensor in a camera. The Z axis motion may, forexample, be for optical focusing or autofocus purposes in cameras thatincorporate focusing/autofocus mechanisms. Example embodiments of anoptical image stabilization (OIS) voice coil motor (VCM) actuator areillustrated as actuator module 3000 in FIGS. 4-6. Embodiments of theactuator module 1000 may, for example, be used in a miniature or smallform factor camera suitable for small, mobile multipurpose devices suchas cell phones, smartphones, and pad or tablet devices, as describedbelow with respect to FIGS. 11-12.

FIG. 1B illustrates components of an example actuator module 1000 thatprovides X, Y and Z motions for an optics component 1002, according toat least some embodiments. In some embodiments, an optics assembly ofthe actuator module 1000 may include an optics component 1002 that iscoupled to an actuator component 1004 by upper and/or lower springs 1030and 1032. Note that the object field side of the optics component 1002may be referred to as the top or upper side or surface of the actuatormodule 1000 and optics assembly, while the photosensor side of theoptics component 1002 may be referred to as the bottom or lower side orsurface of the actuator module 1000 and optics assembly. The actuatorcomponent 1004 may, for example, include magnets used in a voice coilmotor (VCM) actuator mechanism. The springs 1030 and 1032 may beflexible to allow motion of the optics component 1002 on the Z axisrelative to the actuator component 1004. The actuator mechanism may beconfigured to move the optics component 1002 on the Z axis within theactuator module 1000 to provide focusing or autofocus for the camera.The optics assembly, which includes at least optics component 1002,actuator component 1004, and springs 1030 and 1032, may be suspendedwithin the actuator module 1000 on two or more suspension wires 1020.For example, the suspension wires 1020 may be mounted to base 1008, andthe optics assembly may be suspended on the wires 1020 at the outerportion of the upper springs 1030. The suspension wires 1020 may beflexible to allow motion of the optics assembly, and thus of the opticscomponent 1002, on the XY axes orthogonal to the Z (optical) axis of theoptics component 1002. The actuator component 1002 may be configured tomove the optics assembly and thus the optics component 1002 on the XYaxes within the actuator module 1000 to provide optical imagestabilization (OIS) for the camera.

A challenge with optical image stabilization (OIS) within an actuatormodule 1000 of a camera is the capacity to control the optics component1002 and to displace the optics component 1002 accurately back to theoptical center relative to the XY plane when subject to externalexcitation or disturbance. FIG. 2 illustrates instability of an OISvoice coil motor (VCM) actuator under an external excitation ordisturbance that is equal to a natural resonant frequency. In at leastsome embodiments, an OIS VCM actuator mechanism has, by design, specificnatural resonant frequency modes noted as F₀, F₁, . . . F_(n). Factorsincluding one or more of structure, material, geometry, assembly, mass,and so on may affect these natural resonant frequency modes. FIG. 2shows a spike at natural resonant frequency mode F₀. In XY excitation,the first order of natural resonant frequency F₀ for an OIS VCM actuatormechanism is typically low, for instance around 60 Hz.

In terms of controlling the actuator mechanism, it may be difficult tostabilize the optics under an external excitation or disturbance that isequal to a natural resonant frequency of the actuator mechanism, whichmay limit the performance of the control system for the actuatormechanism. If the system falls into one of these frequencies under anexternal excitation, the moving component of the actuator module mayexhibit higher amplitude of movement, shown as the gain in FIG. 2. As aresult, the system may become unstable. When the system becomesunstable, image quality is adversely affected.

In order to improve the stability of systems including but not limitedto OIS VCM actuator systems, a solution is to use one or more passivedamping techniques. FIG. 3 illustrates stabilization of an OIS VCMactuator under an external excitation or disturbance that is equal to anatural resonant frequency using a passive damping technique, accordingto at least some embodiments. The dashed line shows how a passivedamping technique may smooth the spike at natural resonant frequencymode F₀.

An example passive damping technique involves the application of anon-rigid, viscous and/or elastic (or viscoelastic) substance ormaterial at one or more locations within a system, an example of whichis a silicon gel that may be applied at location(s) within the systemand activated by the application of UV light. Silicon damping gels havebeen applied in various systems for improving stability and increasingcontrol performance. However, note that other gels, substances,materials, and/or mechanisms may be used in various passive dampingtechniques.

FIGS. 4-6 illustrate embodiments of an example actuator module in whichembodiments of a passive damping techniques as described herein may beapplied. In particular, embodiments of the passive damping techniquesmay be applied within an actuator module 3000 as illustrated in FIGS.4-6 to stabilize and increase control performance during optical imagestabilization (OIS) of an optics assembly 3060 suspended on wires 3020within an actuator module 3000 as shown in FIG. 4.

FIG. 4 shows a side view of an example embodiment of an actuator module3000 that may, for example, be used in small form factor cameras,according to at least some embodiments, and in which embodiments of apassive damping technique may be applied. FIGS. 5-6 show a top views ofactuator modules similar to actuator module 3000 of FIG. 4 with thecover removed. FIGS. 7A-7E show assembly of the actuator module 3000 ofFIG. 4 according to at least some embodiments.

As shown in FIGS. 4-5, an actuator module 4000 including an opticsassembly 3060 may be part of a camera module 3000 and may include a base3008, an optics component 3002, and a cover 3012. Cover 3012 may beattached to the base 3008, substantially enclosing the optics assembly3060 while leaving an aperture to allow light from an object field infront of the camera module 3000 to reach the optics component 3002 andleaving an opening in base 3008 to allow light refracted from opticscomponent 3002 to reach the image sensor 3050. Base 3008 may include oneor more of, but is not limited to a ceramic substrate, to which isattached one or more magnet displacement sensors 3010, and suspensionwires 3020 around which are disposed passive dampers 3040. In at leastsome embodiments, there are four suspension wires 3020. An opticsassembly 3002 may be suspended on the base 3008 by suspension of theupper springs 3030 of optics assembly 3002 on the suspension wires 3020.Camera module 3000 may include one or more of, but is not limited to,optics component 3002, optics holder 3004, magnet holder(s) 3006, upperspring(s) 3030, and lower spring(s) 3032. The upper and lower spring(s)may be collectively referred to herein as optics springs. In actuatormodule 4000, an optics component 3002 (e.g., a lens or lens assembly)may be screwed, mounted or otherwise held in or by an optics holder3004. In at least some embodiments, the optics component 3002/opticsholder 3004 assembly may be suspended from or attached to the magnetholder 3006 by upper spring(s) 3030, and lower spring(s) 3032. Note thatupper spring(s) 3030 and lower spring(s) 3032 are flexible to allow theactuator assembly 3060 a range of motion along the Z (optical) axis foroptical focusing, and wires 3020 are flexible to allow a range of motionon the XY plane orthogonal to the optical axis for optical imagestabilization.

One of skill in the art will readily comprehend in light of having readthe present disclosure that, in some embodiments, an actuator module4000 of camera module 3000 may not include magnets and magnet holder(s)3006, but may include a yoke or other structure that may be used to helpsupport the optics assembly 3060 on suspension wires 3020 via uppersprigs 3030. Such embodiments do not depart from the scope of thepresent disclosure. However in some embodiments, actuator module 4000may not include some elements and may include some others not describedherein for the sake of simplicity in illustration. In general, otherembodiments of an actuator module 4000 may include fewer or morecomponents than the example actuator module 4000 shown in FIGS. 4-5.Also note that, while embodiments show the actuator module 4000suspended on wires 3020, other mechanisms may also be used to suspend anactuator module assembly 4000 in other embodiments without departingfrom the scope of the present disclosure.

In some embodiments, an optics assembly 3060 including an opticscomponent 3002 is configured to move within an apparatus, such as acamera module 3000, on one or more axes orthogonal to an optical axis ofthe optics component 3002 (z). The optics assembly 3060 is suspended bya plurality of wires 3020 on a base component 3008 of the apparatus3000, each wire 3020 being substantially parallel to the optical axis ofthe optics component 3002. One or more passive dampers 3040 is disposedaround the plurality of wires 3020, The passive dampers 3040 areconfigured to passively dampen motions of the optics assembly 3060within the apparatus.

In some embodiments, the optics assembly 3060 includes a pocket, step,cavity, or indentation (shown in FIG. 5 as being filled with passivedamper 3040) at each passive damper 3040 location that is configured tocontain material of the passive damper 3040 during displacement.

In some embodiments, a component of the optics assembly 3060 includes athrough-pipe cavity (shown in FIG. 5 as being filled with passive damper3040) at each passive damper 3040 location that is configured to containmaterial of the passive damper 3040 during displacement and allowpassage of one of the plurality of wires 3020.

In some embodiments, a component of the optics assembly 3060 includes au-shaped cavity indentation open on one side and both (shown in FIG. 6as being filled with passive damper 3040) ends at each passive damper3040 location that is configured to contain material of the passivedamper 3040 during displacement and allow passage of one of theplurality of wires.

In some embodiments, the optics assembly 3060 includes a magnet holder3006 having a pocket, step, cavity, or indentation (shown in FIG. 5 asbeing filled with passive damper 3040) at each passive damper 3040location that is configured to contain material of the passive damper3040 during displacement.

In some embodiments, the optics assembly 3060 includes an optics holder3004 having a pocket, step, cavity, or indentation at each passivedamper 3040 location that is configured to contain material of thepassive damper 3040 during displacement

In some embodiments, the optics assembly includes a coil holder 3004having a pocket, step, cavity, or indentation at each passive damperlocation 3040 that is configured to contain material of the passivedamper 3040 during displacement.

In some embodiments, the fixed component is a cover 3012 coupled to thebase component 3008. In some embodiments, the optics assembly 3060includes a pocket, step, cavity, or indentation at each passive damper3040 location that are configured to contain material of the passivedamper during displacement.

In some embodiments, each passive damper 3040 is composed of aviscoelastic gel material that contacts an inner surface of the opticsassembly 3060 and one of the plurality of wires 3020 to provide passivedamping to motions of the optics assembly 3060 within the apparatus. Insome embodiments, the viscoelastic material is a silicon gel. In someembodiments, the viscoelastic material is a silicone gel.

In some embodiments, the optics assembly 3060 further comprises anactuator component 4000, and the actuator component 4000 is coupled tothe optics component 3002 by one or more springs that provide optical(Z) axis movement to the optics component relative to the actuatorcomponent. In some embodiments, the passive dampers 3040 are disposedbetween an inner surface of the optics assembly 3060 and one of theplurality of wires 3020 to provide passive damping to motions of theoptics assembly 3060 within the apparatus 3000.

FIG. 5 shows a top view of an example actuator module 4000, according toat least some embodiments, and is not intended to be limiting. In FIG.5, base 3008 and suspension wires 3020 with passive dampers 3040 areshown in FIG. 5, while optics 3002, optics holder 3004, magnet holders3006, lower optics spring 3032, and upper optics spring 3030 are alsoshown. The cover 3012 is not shown in FIG. 5. FIG. 5 shows examplelocations for four suspension wires 3020 and corresponding dampers atthrough-holes drilled near the corners magnet holders 3006 of theactuator module 4000, an example location/configuration of upper opticssprings 3030 that suspend optics assembly 3060 on suspension wires 3020and to which magnet holder(s) and optics holder 3004 are attached andthus suspended, and an example location/configuration of lower opticsspring 3032 attached to the bottoms or lower surfaces of magnetholder(s) and optics holder 3004. Note that more or fewer suspensionwires 3020 may be used in some embodiments.

In the example configuration shown in FIG. 5, four separate magnetholders 3006 are shown disposed around optics holder 3004, each attachedto optics springs 3030 and 3032, and each typically holding one of fourmagnets used in the example actuator module 3000. FIG. 6 shows analternative configuration for a magnet holder or yoke in a camera module3000. FIG. 6 shows an embodiment in which suspension wires pass throughan open u-cavity in magnet holders 3006 for housing passive dampers3040, each holding two magnets, with one magnet holder 3006 located oneach side of optics holder 3004.

In embodiments of passive damping techniques for an actuator module asdescribed herein, referring to FIGS. 4-5 the locations where the passivedamping gel (or other passive damper) is applied is/are disposed aroundthe suspension wires of the moving assembly (the actuator assembly4000).

The location of the passive damping material 3040 at locations disposedaround the plurality of wires 3020, in some embodiments, adjusted to alocation favorable for process control and automation duringmanufacturing and assembly of a camera module 3000, as illustrated inFIGS. 7-10. In addition, at least some embodiments may include designelements that provide for the integrity and reliability of the dampinggel over the life cycle of the camera module 3000.

However, it is to be noted that passive dampers as described herein maybe applied at one or more other locations within an actuator module 3000instead of or in addition to locations disposed around suspension wires3020. For example, in some embodiments, instead of or in addition tolocating passive dampers disposed around suspension wires 3020,additional passive dampers may be located at the top of the opticsassembly 4000 between the optics assembly 3060 and the cover 3012 of theactuator module 3000, or passive dampers may be located at the bottom ofthe optics assembly 3060 between the optics assembly 3060 and the base3008 of the camera module 3000. For example, in some embodiments, thelocations where the passive dampers 3040 are applied may be between amagnet holder 3006 component of the actuator module 4000 and magnetdisplacement sensors 3010 attached to base 3008.

FIGS. 4-6 show embodiments of passive damping components, mechanisms, ormaterials 3040 (e.g., a damping gel such as a silicon or siliconedamping gel), as applied according to at least some embodiments, but areintended to be merely examples and not limiting of the informationpresented in the present disclosure. For simplicity, each passivedamping component in the module 3000 may be referred to as a passivedamper 3040. In at least some embodiments, each passive damper 3040 maybe an application of a silicon damping gel that may, for example, becured by application of UV light. However, note that other gels,materials, substances, or mechanisms may be used as passive dampers 3040at the locations shown in FIGS. 4-6 instead of or in addition to silicondamping gel dampers 3040.

The application or disposition of passive dampers 3040 at theselocations, physical properties of the passive damper 3040 material(e.g., a silicon gel) such as viscosity and/or elasticity(viscoelasticity), and the contact of the passive dampers with a surfaceof the moving component (optics assembly 3060) and with wires 3020 actto passively dampen the motion of optics assembly 3060 during opticalimage stabilization (OIS) of the optics assembly 3060 when subjected toexternal excitation or disturbance.

In some embodiments, in addition to damping motion the passive dampers3040 (e.g., damping gel) disposed around wires 3020 may also act as adamper or “shock absorber,” which may improve reliability, dampingacceleration and reducing impact shock of the optics assembly 3060within the actuator module 3000.

In addition, the location of the passive dampers disposed about thesuspension wires 3020 of the optics assembly 3060 may be a favorablelocation for process control and automation during manufacturing andassembly of an actuator module 4000. In addition, at least someembodiments may include design elements that provide for the integrityand reliability of the passive dampers 3040 over the life cycle of theactuator module 3000.

However, as previously noted, passive dampers 3040 may be applied at oneor more other locations within an actuator module 3000 instead of or inaddition to locations disposed about the plurality of wires 3020 ofoptics assembly 3060.

Applying the passive dampers 3040 disposed about the plurality of wires3020 of the actuator module 4000 may improve the level of dampingperformance and damping ratio (Q factor) as the relative motion betweenthe moving and static parts reduces significantly. Note that this mayimpact gel volume, as less gel may be used to provide a target Q dampingratio. As a result, this may improve the manufacturability, dispense andcycle time.

By locating the passive dampers 3040 within optics assembly 3060, thedamping gel is further away from temperature sources such as the imagesensor 3050 (e.g., a CMOS or CCD photosensor) and the voice coil motor(VCM) coils which may typically be located in or on base 3008. This mayact to improve damping performance by reducing variation of theviscoelastic or other properties of the material (e.g., silicon gel)related to temperature.

By locating the passive dampers 3040 within optics assembly 3060, thedamping gel can easily be dispensed during manufacturing and assembly ofan actuator module 4000, since the passive damping is applied at anaccessible location. The actuator module 4000 assembly process can bevery specific, but typically the EMI shield can (cover 3012) is mountedlast. In addition, this allows for improved process control andautomation when applying the passive damping. Thus, this location of thepassive damping material on top of the optics assembly 4000 may be afavorable design for process control and automation during manufacturingand assembly of an OIS VCM actuator module. An example manufacturing andassembly process is illustrated in FIGS. 7A through 8E.

Passive Damper Integrity and Reliability

At least some embodiments may include design elements that provide forthe integrity and reliability of the passive damping material (e.g.,damping gel) over the life cycle of the actuator module 4000. Thus, atleast some embodiments may deposit each passive damper 3040 material ator in a site such as pocket, step, cavity, indentation, etc. within acomponent of optics assembly 3060 that may act to contain the passivedamper 3040 material and help prevent the material from squeezing out orspreading too much during displacement events. Note that the size(L×W×H) and/or shape of the pocket may be designed in accordance withthe volume of the passive damper 3040 (e.g., damping gel) material. Inother words, the pocket may be designed with a size and shape that canaccommodate most or all of the passive damper 3040 (e.g., damping gel)material during a displacement.

Manufacturing, Process Control, and Automation Methods

FIGS. 7A through 7E graphically illustrate an example manufacturingprocess for an actuator module 4000 as shown in FIG. 5 that may be usedin a small form factor camera 3000, according to at least someembodiments, and is not intended to be limiting. The process is shown ata high level, with five major stages or steps shown in FIGS. 7A through7E. FIG. 9 is a flowchart of a method for manufacturing an actuatormodule 4000 that may be used in a small form factor camera 3000,according to at least some embodiments.

As shown in FIG. 7A and at 3200 of FIG. 9, a base assembly for anactuator module 3008 is assembled. An example base assembly 3008 isshown in FIG. 4. However, the suspension wires 3020 may not initially beattached to the base assembly 3008.

As shown in FIG. 7B and at 3210 of FIG. 15, an optics assembly isassembled. An example optics assembly 4000 is shown in FIG. 5. Note thatthe manufacturing steps represented in FIGS. 7A and 7B and at 3200 and3210 of FIG. 15 may be performed substantially in parallel, e.g. onseparate production lines that merge at FIG. 7C.

As shown in FIG. 7C and at 3220 of FIG. 9, the optics assembly (e.g., anoptics assembly 3060) may be suspended on/attached to the base assembly(e.g., base assembly 3008) via suspension wires 3020, e.g., four wiresor beams disposed at the corners of the base. In at least someembodiments, the optics assembly is suspended on the wires 3020 viaupper optics spring 3030 components of the actuator module 4000. Thewires 3020 may provide motion to the optics assembly 3060 on the XYplane for optical image stabilization (OIS).

As shown in FIG. 7D and at 3230 of FIG. 9, the passive damping material(e.g., a damping gel such as a silicon gel) is deposited at locationsdisposed around the suspension wires 3020. FIGS. 8A through 8Dgraphically illustrate an example method for passive damper 3040 (e.g.,damping gel) material application as shown in FIG. 7D. FIG. 10 providesan example of a manufacturing method that may be performed at 3230 ofFIG. 9 to apply damping gel at locations disposed around the suspensionwires 3020 of an optics assembly 3060.

As shown in FIG. 7E and at 3240 of FIG. 9, a cover (e.g., a cover 3012with an opening for the optics component 3002 as shown in FIG. 5) may beattached to the base assembly 3008, substantially enclosing the opticsassembly 3060 while leaving an aperture in cover 3012 to allow lightfrom an object field in front of the camera module 3000 to reach theoptics component 3002 and leaving an opening in base assembly 3008 toallow light refracted from optics component 3002 to reach the imagesensor 3050. The cover 3012 and base assembly 3008 form a fixed orstatic portion of the actuator module 4000, while the optics assembly3060 is a moving portion of the actuator module 4000.

The application of the passive dampers 3040 at these locations, physicalproperties of the passive damper 3040 material (e.g., a silicon gel)such as viscoelasticity, and the contact of the passive dampers with asurface of the moving component (optics assembly 3060) and with asurface of the wires 3020 dampen the motion of optics assembly 3060within the actuator module 4000 during optical image stabilization (OIS)of the optics assembly 3060 when subjected to external excitation ordisturbance, and may also provide damping and reduce impact shock forthe optics assembly 3060.

FIGS. 8A through 8D graphically illustrate an example method for passivedamping material (e.g., a damping gel such as a silicon gel) applicationas shown at FIG. 7D and at 3230 of FIG. 9, according to at least someembodiments, and is not intended to be limiting. The method may involveone or more of, but is not limited to, four stages or steps as shown asFIGS. 8A through 8D. FIG. 10 is a flowchart of a method for passivedamping material application at element 3230 of the method shown in FIG.9, according to at least some embodiments, and is not intended to belimiting.

As shown in FIG. 8A and at 3232 of FIG. 10, the passive damper 3040material (e.g., a silicon damping gel) is dispensed to one or morelocations on the upper surface of an optics assembly 3060 as describedherein.

As shown in FIG. 8B and at 3234 of FIG. 10, a vertical automated opticalinspection (AOI) may be performed to determine if the passive damper3040 material is properly positioned at locations disposed around thesuspension wires 3020, and to determine that the extent of the materialthat was dispensed is within minimum and maximum boundaries. Note thatthis boundary check may also check the volume of damping material thatwas deposited.

As shown in FIG. 8C and at 3236 of FIG. 10, the passive damper 3040material may be cured. For example, a silicon damping gel may be curedvia the application of ultraviolet (UV) light by a UV light source at adistance d from the optics assembly surface.

As shown at in FIG. 8D and at 3238 of FIG. 10, an automated opticalinspection (AOI) profile scan may be performed to determine if thepassive damper 3040 material as cured at FIG. 8C and 3236 of FIG. 18 iswithin a height H tolerance and within a diameter D tolerancewithinoptics assembly 3060.

Multifunction Device Examples

Embodiments of electronic devices in which embodiments of camera modules3000 as described herein may be used, user interfaces for such devices,and associated processes for using such devices are described. In someembodiments, the device is a portable communications device, such as amobile telephone, that also contains other functions, such as PDA and/ormusic player functions. Other portable electronic devices, such aslaptops, cell phones, pad devices, or tablet computers withtouch-sensitive surfaces (e.g., touch screen displays and/or touchpads), may also be used. It should also be understood that, in someembodiments, the device is not a portable communications device, but isa desktop computer with a touch-sensitive surface (e.g., a touch screendisplay and/or a touch pad). In some embodiments, the device is a gamingcomputer with orientation sensors (e.g., orientation sensors in a gamingcontroller). In other embodiments, the device is not a portablecommunications device, but is a camera.

In the discussion that follows, an electronic device that includes adisplay and a touch-sensitive surface is described. It should beunderstood, however, that the electronic device may include one or moreother physical user-interface devices, such as a physical keyboard, amouse and/or a joystick.

The device typically supports a variety of applications, such as one ormore of the following: a drawing application, a presentationapplication, a word processing application, a website creationapplication, a disk authoring application, a spreadsheet application, agaming application, a telephone application, a video conferencingapplication, an e-mail application, an instant messaging application, aworkout support application, a photo management application, a digitalcamera application, a digital video camera application, a web browsingapplication, a digital music player application, and/or a digital videoplayer application.

The various applications that may be executed on the device may use atleast one common physical user-interface device, such as thetouch-sensitive surface. One or more functions of the touch-sensitivesurface as well as corresponding information displayed on the device maybe adjusted and/or varied from one application to the next and/or withina respective application. In this way, a common physical architecture(such as the touch-sensitive surface) of the device may support thevariety of applications with user interfaces that are intuitive andtransparent to the user.

Attention is now directed toward embodiments of portable devices withcameras. FIG. 11 is a block diagram illustrating portable multifunctiondevice 100 with camera 164 in accordance with some embodiments. Camera164 is sometimes called an “optical sensor” for convenience, and mayalso be known as or called an optical sensor system. Embodiments of anactuator module 3000 that includes passive damping for optical imagestabilization (OIS) may be used in the optical sensor/camera(s) 164 of adevice 100.

Device 100 may include memory 102 (which may include one or morecomputer readable storage mediums), memory controller 122, one or moreprocessing units (CPU's) 120, peripherals interface 118, RF circuitry108, audio circuitry 110, speaker 111, touch-sensitive display system112, microphone 113, input/output (I/O) subsystem 106, other input orcontrol devices 116, and external port 124. Device 100 may include oneor more optical sensors 164. These components may communicate over oneor more communication buses or signal lines 103.

It should be appreciated that device 100 is only one example of aportable multifunction device, and that device 100 may have more orfewer components than shown, may combine two or more components, or mayhave a different configuration or arrangement of the components. Thevarious components shown in FIG. 27 may be implemented in hardware,software, or a combination of hardware and software, including one ormore signal processing and/or application specific integrated circuits.

Memory 102 may include high-speed random access memory and may alsoinclude non-volatile memory, such as one or more magnetic disk storagedevices, flash memory devices, or other non-volatile solid-state memorydevices. Access to memory 102 by other components of device 100, such asCPU 120 and the peripherals interface 118, may be controlled by memorycontroller 122.

Peripherals interface 118 can be used to couple input and outputperipherals of the device to CPU 120 and memory 102. The one or moreprocessors 120 run or execute various software programs and/or sets ofinstructions stored in memory 102 to perform various functions fordevice 100 and to process data.

In some embodiments, peripherals interface 118, CPU 120, and memorycontroller 122 may be implemented on a single chip, such as chip 104. Insome other embodiments, they may be implemented on separate chips.

RF (radio frequency) circuitry 108 receives and sends RF signals, alsocalled electromagnetic signals. RF circuitry 108 converts electricalsignals to/from electromagnetic signals and communicates withcommunications networks and other communications devices via theelectromagnetic signals. RF circuitry 108 may include well-knowncircuitry for performing these functions, including but not limited toan antenna system, an RF transceiver, one or more amplifiers, a tuner,one or more oscillators, a digital signal processor, a CODEC chipset, asubscriber identity module (SIM) card, memory, and so forth. RFcircuitry 108 may communicate with networks, such as the Internet, alsoreferred to as the World Wide Web (WWW), an intranet and/or a wirelessnetwork, such as a cellular telephone network, a wireless local areanetwork (LAN) and/or a metropolitan area network (MAN), and otherdevices by wireless communication. The wireless communication may useany of a variety of communications standards, protocols andtechnologies, including but not limited to Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), high-speeddownlink packet access (HSDPA), high-speed uplink packet access (HSUPA),wideband code division multiple access (W-CDMA), code division multipleaccess (CDMA), time division multiple access (TDMA), Bluetooth, WirelessFidelity (Wi-Fi) (e.g., IEEE 802.11a, IEEE 802.11b, IEEE 802.11g and/orIEEE 802.11n), voice over Internet Protocol (VoIP), Wi-MAX, a protocolfor e-mail (e.g., Internet message access protocol (IMAP) and/or postoffice protocol (POP)), instant messaging (e.g., extensible messagingand presence protocol (XMPP), Session Initiation Protocol for InstantMessaging and Presence Leveraging Extensions (SIMPLE), Instant Messagingand Presence Service (IMPS)), and/or Short Message Service (SMS), or anyother suitable communication protocol, including communication protocolsnot yet developed as of the filing date of this document.

Audio circuitry 110, speaker 111, and microphone 113 provide an audiointerface between a user and device 100. Audio circuitry 110 receivesaudio data from peripherals interface 118, converts the audio data to anelectrical signal, and transmits the electrical signal to speaker 111.Speaker 111 converts the electrical signal to human-audible sound waves.Audio circuitry 110 also receives electrical signals converted bymicrophone 113 from sound waves. Audio circuitry 110 converts theelectrical signal to audio data and transmits the audio data toperipherals interface 118 for processing. Audio data may be retrievedfrom and/or transmitted to memory 102 and/or RF circuitry 108 byperipherals interface 118. In some embodiments, audio circuitry 110 alsoincludes a headset jack (e.g., 212, FIG. 2). The headset jack providesan interface between audio circuitry 110 and removable audioinput/output peripherals, such as output-only headphones or a headsetwith both output (e.g., a headphone for one or both ears) and input(e.g., a microphone).

I/O subsystem 106 couples input/output peripherals on device 100, suchas touch screen 112 and other input control devices 116, to peripheralsinterface 118. I/O subsystem 106 may include display controller 156 andone or more input controllers 160 for other input or control devices.The one or more input controllers 160 receive/send electrical signalsfrom/to other input or control devices 116. The other input controldevices 116 may include physical buttons (e.g., push buttons, rockerbuttons, etc.), dials, slider switches, joysticks, click wheels, and soforth. In some alternative embodiments, input controller(s) 160 may becoupled to any (or none) of the following: a keyboard, infrared port,USB port, and a pointer device such as a mouse. The one or more buttons(e.g., 208, FIG. 2) may include an up/down button for volume control ofspeaker 111 and/or microphone 113. The one or more buttons may include apush button (e.g., 206, FIG. 2).

Touch-sensitive display 112 provides an input interface and an outputinterface between the device and a user. Display controller 156 receivesand/or sends electrical signals from/to touch screen 112. Touch screen112 displays visual output to the user. The visual output may includegraphics, text, icons, video, and any combination thereof (collectivelytermed “graphics”). In some embodiments, some or all of the visualoutput may correspond to user-interface objects.

Touch screen 112 has a touch-sensitive surface, sensor or set of sensorsthat accepts input from the user based on haptic and/or tactile contact.Touch screen 112 and display controller 156 (along with any associatedmodules and/or sets of instructions in memory 102) detect contact (andany movement or breaking of the contact) on touch screen 112 andconverts the detected contact into interaction with user-interfaceobjects (e.g., one or more soft keys, icons, web pages or images) thatare displayed on touch screen 112. In an example embodiment, a point ofcontact between touch screen 112 and the user corresponds to a finger ofthe user.

Touch screen 112 may use LCD (liquid crystal display) technology, LPD(light emitting polymer display) technology, or LED (light emittingdiode) technology, although other display technologies may be used inother embodiments. Touch screen 112 and display controller 156 maydetect contact and any movement or breaking thereof using any of avariety of touch sensing technologies now known or later developed,including but not limited to capacitive, resistive, infrared, andsurface acoustic wave technologies, as well as other proximity sensorarrays or other elements for determining one or more points of contactwith touch screen 112. In an example embodiment, projected mutualcapacitance sensing technology may be used.

Touch screen 112 may have a video resolution in excess of 100 dots perinch (dpi). In some embodiments, the touch screen has a video resolutionof approximately 160 dpi. The user may make contact with touch screen112 using any suitable object or appendage, such as a stylus, a finger,and so forth. In some embodiments, the user interface is designed towork primarily with finger-based contacts and gestures, which can beless precise than stylus-based input due to the larger area of contactof a finger on the touch screen. In some embodiments, the devicetranslates the rough finger-based input into a precise pointer/cursorposition or command for performing the actions desired by the user.

In some embodiments, in addition to the touch screen, device 100 mayinclude a touchpad (not shown) for activating or deactivating particularfunctions. In some embodiments, the touchpad is a touch-sensitive areaof the device that, unlike the touch screen, does not display visualoutput. The touchpad may be a touch-sensitive surface that is separatefrom touch screen 112 or an extension of the touch-sensitive surfaceformed by the touch screen.

Device 100 also includes power system 162 for powering the variouscomponents. Power system 162 may include a power management system, oneor more power sources (e.g., battery, alternating current (AC)), arecharging system, a power failure detection circuit, a power converteror inverter, a power status indicator (e.g., a light-emitting diode(LED)) and any other components associated with the generation,management and distribution of power in portable devices.

Device 100 may also include one or more optical sensors or cameras 164.FIG. 27 shows an optical sensor coupled to optical sensor controller 158in I/O subsystem 106. Optical sensor 164 may include charge-coupleddevice (CCD) or complementary metal-oxide semiconductor (CMOS)phototransistors. Optical sensor 164 receives light from theenvironment, projected through one or more lens, and converts the lightto data representing an image. In conjunction with imaging module 143(also called a camera module), optical sensor 164 may capture stillimages or video. In some embodiments, an optical sensor is located onthe back of device 100, opposite touch screen display 112 on the frontof the device, so that the touch screen display may be used as aviewfinder for still and/or video image acquisition. In someembodiments, another optical sensor is located on the front of thedevice so that the user's image may be obtained for videoconferencingwhile the user views the other videoconference participants on the touchscreen display.

Device 100 may also include one or more proximity sensors 166. FIG. 27shows proximity sensor 166 coupled to peripherals interface 118.Alternatively, proximity sensor 166 may be coupled to input controller160 in I/O subsystem 106. In some embodiments, the proximity sensorturns off and disables touch screen 112 when the multifunction device isplaced near the user's ear (e.g., when the user is making a phone call).

Device 100 includes one or more orientation sensors 168. In someembodiments, the one or more orientation sensors include one or moreaccelerometers (e.g., one or more linear accelerometers and/or one ormore rotational accelerometers). In some embodiments, the one or moreorientation sensors include one or more gyroscopes. In some embodiments,the one or more orientation sensors include one or more magnetometers.In some embodiments, the one or more orientation sensors include one ormore of global positioning system (GPS), Global Navigation SatelliteSystem (GLONASS), and/or other global navigation system receivers. TheGPS, GLONASS, and/or other global navigation system receivers may beused for obtaining information concerning the location and orientation(e.g., portrait or landscape) of device 100. In some embodiments, theone or more orientation sensors include any combination oforientation/rotation sensors. FIG. 11 shows the one or more orientationsensors 168 coupled to peripherals interface 118. Alternatively, the oneor more orientation sensors 168 may be coupled to an input controller160 in I/O subsystem 106. In some embodiments, information is displayedon the touch screen display in a portrait view or a landscape view basedon an analysis of data received from the one or more orientationsensors.

In some embodiments, the software components stored in memory 102include operating system 126, communication module (or set ofinstructions) 128, contact/motion module (or set of instructions) 130,graphics module (or set of instructions) 132, text input module (or setof instructions) 134, Global Positioning System (GPS) module (or set ofinstructions) 135, arbiter module 157 and applications (or sets ofinstructions) 136. Furthermore, in some embodiments memory 102 storesdevice/global internal state 157, as shown in FIGS. 1A and 3.Device/global internal state 157 includes one or more of: activeapplication state, indicating which applications, if any, are currentlyactive; display state, indicating what applications, views or otherinformation occupy various regions of touch screen display 112; sensorstate, including information obtained from the device's various sensorsand input control devices 116; and location information concerning thedevice's location and/or attitude.

Operating system 126 (e.g., Darwin, RTXC, LINUX, UNIX, OS X, WINDOWS, oran embedded operating system such as VxWorks) includes various softwarecomponents and/or drivers for controlling and managing general systemtasks (e.g., memory management, storage device control, powermanagement, etc.) and facilitates communication between various hardwareand software components.

Communication module 128 facilitates communication with other devicesover one or more external ports 124 and also includes various softwarecomponents for handling data received by RF circuitry 108 and/orexternal port 124. External port 124 (e.g., Universal Serial Bus (USB),FIREWIRE, etc.) is adapted for coupling directly to other devices orindirectly over a network (e.g., the Internet, wireless LAN, etc.).

Contact/motion module 130 may detect contact with touch screen 112 (inconjunction with display controller 156) and other touch sensitivedevices (e.g., a touchpad or physical click wheel). Contact/motionmodule 130 includes various software components for performing variousoperations related to detection of contact, such as determining ifcontact has occurred (e.g., detecting a finger-down event), determiningif there is movement of the contact and tracking the movement across thetouch-sensitive surface (e.g., detecting one or more finger-draggingevents), and determining if the contact has ceased (e.g., detecting afinger-up event or a break in contact). Contact/motion module 130receives contact data from the touch-sensitive surface. Determiningmovement of the point of contact, which is represented by a series ofcontact data, may include determining speed (magnitude), velocity(magnitude and direction), and/or an acceleration (a change in magnitudeand/or direction) of the point of contact. These operations may beapplied to single contacts (e.g., one finger contacts) or to multiplesimultaneous contacts (e.g., “multitouch”/multiple finger contacts). Insome embodiments, contact/motion module 130 and display controller 156detect contact on a touchpad.

Contact/motion module 130 may detect a gesture input by a user.Different gestures on the touch-sensitive surface have different contactpatterns. Thus, a gesture may be detected by detecting a particularcontact pattern. For example, detecting a finger tap gesture includesdetecting a finger-down event followed by detecting a finger-up (liftoff) event at the same position (or substantially the same position) asthe finger-down event (e.g., at the position of an icon). As anotherexample, detecting a finger swipe gesture on the touch-sensitive surfaceincludes detecting a finger-down event followed by detecting one or morefinger-dragging events, and subsequently followed by detecting afinger-up (lift off) event.

Graphics module 132 includes various known software components forrendering and displaying graphics on touch screen 112 or other display,including components for changing the intensity of graphics that aredisplayed. As used herein, the term “graphics” includes any object thatcan be displayed to a user, including without limitation text, webpages, icons (such as user-interface objects including soft keys),digital images, videos, animations and the like.

In some embodiments, graphics module 132 stores data representinggraphics to be used. Each graphic may be assigned a corresponding code.Graphics module 132 receives, from applications etc., one or more codesspecifying graphics to be displayed along with, if necessary, coordinatedata and other graphic property data, and then generates screen imagedata to output to display controller 156.

Text input module 134, which may be a component of graphics module 132,provides soft keyboards for entering text in various applications (e.g.,contacts 137, e-mail 140, IM 141, browser 147, and any other applicationthat needs text input).

GPS module 135 determines the location of the device and provides thisinformation for use in various applications (e.g., to telephone 138 foruse in location-based dialing, to camera module 143 as picture/videometadata, and to applications that provide location-based services suchas weather widgets, local yellow page widgets, and map/navigationwidgets).

Applications 136 may include the following modules (or sets ofinstructions), or a subset or superset thereof:

-   -   contacts module 137 (sometimes called an address book or contact        list);    -   telephone module 138;    -   video conferencing module 139;    -   e-mail client module 140;    -   instant messaging (IM) module 141;    -   workout support module 142;    -   camera module 143 for still and/or video images;    -   image management module 144;    -   browser module 147;    -   calendar module 148;    -   widget modules 149, which may include one or more of: weather        widget 149-1, stocks widget 149-2, calculator widget 149-3,        alarm clock widget 149-4, dictionary widget 149-5, and other        widgets obtained by the user, as well as user-created widgets        149-6;    -   widget creator module 150 for making user-created widgets 149-6;    -   search module 151;    -   video and music player module 152, which may be made up of a        video player    -   module and a music player module;    -   notes module 153;    -   map module 154; and/or    -   online video module 155.

Examples of other applications 136 that may be stored in memory 102include other word processing applications, other image editingapplications, drawing applications, presentation applications,JAVA-enabled applications, encryption, digital rights management, voicerecognition, and voice replication.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, and text input module 134, contactsmodule 137 may be used to manage an address book or contact list (e.g.,stored in application internal state 192 of contacts module 137 inmemory 102 or memory 370), including: adding name(s) to the addressbook; deleting name(s) from the address book; associating telephonenumber(s), e-mail address(es), physical address(es) or other informationwith a name; associating an image with a name; categorizing and sortingnames; providing telephone numbers or e-mail addresses to initiateand/or facilitate communications by telephone 138, video conference 139,e-mail 140, or IM 141; and so forth.

In conjunction with RF circuitry 108, audio circuitry 110, speaker 111,microphone 113, touch screen 112, display controller 156, contact module130, graphics module 132, and text input module 134, telephone module138 may be used to enter a sequence of characters corresponding to atelephone number, access one or more telephone numbers in address book137, modify a telephone number that has been entered, dial a respectivetelephone number, conduct a conversation and disconnect or hang up whenthe conversation is completed. As noted above, the wirelesscommunication may use any of a variety of communications standards,protocols and technologies.

In conjunction with RF circuitry 108, audio circuitry 110, speaker 111,microphone 113, touch screen 112, display controller 156, optical sensor164, optical sensor controller 158, contact module 130, graphics module132, text input module 134, contact list 137, and telephone module 138,videoconferencing module 139 includes executable instructions toinitiate, conduct, and terminate a video conference between a user andone or more other participants in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, and text inputmodule 134, e-mail client module 140 includes executable instructions tocreate, send, receive, and manage e-mail in response to userinstructions. In conjunction with image management module 144, e-mailclient module 140 makes it very easy to create and send e-mails withstill or video images taken with camera module 143.

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, and text inputmodule 134, the instant messaging module 141 includes executableinstructions to enter a sequence of characters corresponding to aninstant message, to modify previously entered characters, to transmit arespective instant message (for example, using a Short Message Service(SMS) or Multimedia Message Service (MMS) protocol for telephony-basedinstant messages or using XMPP, SIMPLE, or IMPS for Internet-basedinstant messages), to receive instant messages and to view receivedinstant messages. In some embodiments, transmitted and/or receivedinstant messages may include graphics, photos, audio files, video filesand/or other attachments as are supported in a MMS and/or an EnhancedMessaging Service (EMS). As used herein, “instant messaging” refers toboth telephony-based messages (e.g., messages sent using SMS or MMS) andInternet-based messages (e.g., messages sent using XMPP, SIMPLE, orIMPS).

In conjunction with RF circuitry 108, touch screen 112, displaycontroller 156, contact module 130, graphics module 132, text inputmodule 134, GPS module 135, map module 154, and music player module 146,workout support module 142 includes executable instructions to createworkouts (e.g., with time, distance, and/or calorie burning goals);communicate with workout sensors (sports devices); receive workoutsensor data; calibrate sensors used to monitor a workout; select andplay music for a workout; and display, store and transmit workout data.

In conjunction with touch screen 112, display controller 156, opticalsensor(s) 164, optical sensor controller 158, contact module 130,graphics module 132, and image management module 144, camera module 143includes executable instructions to capture still images or video(including a video stream) and store them into memory 102, modifycharacteristics of a still image or video, or delete a still image orvideo from memory 102.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, text input module 134, and cameramodule 143, image management module 144 includes executable instructionsto arrange, modify (e.g., edit), or otherwise manipulate, label, delete,present (e.g., in a digital slide show or album), and store still and/orvideo images.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, and text inputmodule 134, browser module 147 includes executable instructions tobrowse the Internet in accordance with user instructions, includingsearching, linking to, receiving, and displaying web pages or portionsthereof, as well as attachments and other files linked to web pages.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, e-mail client module 140, and browser module 147, calendarmodule 148 includes executable instructions to create, display, modify,and store calendars and data associated with calendars (e.g., calendarentries, to do lists, etc.) in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, and browser module 147, widget modules 149 aremini-applications that may be downloaded and used by a user (e.g.,weather widget 149-1, stocks widget 149-2, calculator widget 1493, alarmclock widget 149-4, and dictionary widget 149-5) or created by the user(e.g., user-created widget 149-6). In some embodiments, a widgetincludes an HTML (Hypertext Markup Language) file, a CSS (CascadingStyle Sheets) file, and a JavaScript file. In some embodiments, a widgetincludes an XML (Extensible Markup Language) file and a JavaScript file(e.g., Yahoo! Widgets).

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, and browser module 147, the widget creator module 150 may beused by a user to create widgets (e.g., turning a user-specified portionof a web page into a widget).

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, and text input module 134,search module 151 includes executable instructions to search for text,music, sound, image, video, and/or other files in memory 102 that matchone or more search criteria (e.g., one or more user-specified searchterms) in accordance with user instructions.

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, audio circuitry 110, speaker111, RF circuitry 108, and browser module 147, video and music playermodule 152 includes executable instructions that allow the user todownload and play back recorded music and other sound files stored inone or more file formats, such as MP3 or AAC files, and executableinstructions to display, present or otherwise play back videos (e.g., ontouch screen 112 or on an external, connected display via external port124). In some embodiments, device 100 may include the functionality ofan MP3 player.

In conjunction with touch screen 112, display controller 156, contactmodule 130, graphics module 132, and text input module 134, notes module153 includes executable instructions to create and manage notes, to dolists, and the like in accordance with user instructions.

In conjunction with RF circuitry 108, touch screen 112, display systemcontroller 156, contact module 130, graphics module 132, text inputmodule 134, GPS module 135, and browser module 147, map module 154 maybe used to receive, display, modify, and store maps and data associatedwith maps (e.g., driving directions; data on stores and other points ofinterest at or near a particular location; and other location-baseddata) in accordance with user instructions.

In conjunction with touch screen 112, display system controller 156,contact module 130, graphics module 132, audio circuitry 110, speaker111, RF circuitry 108, text input module 134, e-mail client module 140,and browser module 147, online video module 155 includes instructionsthat allow the user to access, browse, receive (e.g., by streamingand/or download), play back (e.g., on the touch screen or on anexternal, connected display via external port 124), send an e-mail witha link to a particular online video, and otherwise manage online videosin one or more file formats, such as H.264. In some embodiments, instantmessaging module 141, rather than e-mail client module 140, is used tosend a link to a particular online video.

Each of the above identified modules and applications correspond to aset of executable instructions for performing one or more functionsdescribed above and the methods described in this application (e.g., thecomputer-implemented methods and other information processing methodsdescribed herein). These modules (i.e., sets of instructions) need notbe implemented as separate software programs, procedures or modules, andthus various subsets of these modules may be combined or otherwisere-arranged in various embodiments. In some embodiments, memory 102 maystore a subset of the modules and data structures identified above.Furthermore, memory 102 may store additional modules and data structuresnot described above.

In some embodiments, device 100 is a device where operation of apredefined set of functions on the device is performed exclusivelythrough a touch screen and/or a touchpad. By using a touch screen and/ora touchpad as the primary input control device for operation of device100, the number of physical input control devices (such as push buttons,dials, and the like) on device 100 may be reduced.

The predefined set of functions that may be performed exclusivelythrough a touch screen and/or a touchpad include navigation between userinterfaces. In some embodiments, the touchpad, when touched by the user,navigates device 100 to a main, home, or root menu from any userinterface that may be displayed on device 100. In such embodiments, thetouchpad may be referred to as a “menu button.” In some otherembodiments, the menu button may be a physical push button or otherphysical input control device instead of a touchpad.

FIG. 12 illustrates a portable multifunction device 100 having a touchscreen 112 in accordance with some embodiments. The touch screen maydisplay one or more graphics within user interface (UI) 200. In thisembodiment, as well as others described below, a user may select one ormore of the graphics by making a gesture on the graphics, for example,with one or more fingers 202 (not drawn to scale in the Figure) or oneor more styluses 203 (not drawn to scale in the figure).

Device 100 may also include one or more physical buttons, such as “home”or menu button 204. As described previously, menu button 204 may be usedto navigate to any application 136 in a set of applications that may beexecuted on device 100. Alternatively, in some embodiments, the menubutton is implemented as a soft key in a graphics user interface (GUI)displayed on touch screen 112.

In one embodiment, device 100 includes touch screen 112, menu button204, push button 206 for powering the device on/off and locking thedevice, volume adjustment button(s) 208, Subscriber Identity Module(SIM) card slot 210, head set jack 212, and docking/charging externalport 124. Push button 206 may be used to turn the power on/off on thedevice by depressing the button and holding the button in the depressedstate for a predefined time interval; to lock the device by depressingthe button and releasing the button before the predefined time intervalhas elapsed; and/or to unlock the device or initiate an unlock process.In an alternative embodiment, device 100 also may accept verbal inputfor activation or deactivation of some functions through microphone 113.

It should be noted that, although many of the examples herein are givenwith reference to optical sensor/camera 164 (on the front of a device),a rear-facing camera or optical sensor that is pointed opposite from thedisplay may be used instead of or in addition to an opticalsensor/camera 164 on the front of a device. Embodiments of an actuatormodule 3000 that includes passive damping for optical imagestabilization (OIS) may be used in the optical sensor/camera(s) 164

Example Computer System

FIG. 13 illustrates an example computer system 1300 that may beconfigured to include or execute any or all of the embodiments describedabove. In different embodiments, computer system 1300 may be any ofvarious types of devices, including, but not limited to, a personalcomputer system, desktop computer, laptop, notebook, tablet, slate, pad,or netbook computer, cell phone, smartphone, PDA, portable media device,mainframe computer system, handheld computer, workstation, networkcomputer, a camera or video camera, a set top box, a mobile device, aconsumer device, video game console, handheld video game device,application server, storage device, a television, a video recordingdevice, a peripheral device such as a switch, modem, router, or ingeneral any type of computing or electronic device.

Various embodiments of a camera motion control system as describedherein, may be executed in one or more computer systems 1300, which mayinteract with various other devices. Note that any component, action, orfunctionality described above with respect to FIGS. 1 through 26 may beimplemented on one or more computers configured as computer system 1300of FIG. 13, according to various embodiments. In the illustratedembodiment, computer system 1300 includes one or more processors 1310coupled to a system memory 1320 via an input/output (I/O) interface1330. Computer system 1300 further includes a network interface 1340coupled to I/O interface 1330, and one or more input/output devices1350, such as cursor control device 1360, keyboard 1370, and display(s)1380. In some cases, it is contemplated that embodiments may beimplemented using a single instance of computer system 1300, while inother embodiments multiple such systems, or multiple nodes making upcomputer system 1300, may be configured to host different portions orinstances of embodiments. For example, in one embodiment some elementsmay be implemented via one or more nodes of computer system 1300 thatare distinct from those nodes implementing other elements.

In various embodiments, computer system 1300 may be a uniprocessorsystem including one processor 1310, or a multiprocessor systemincluding several processors 1310 (e.g., two, four, eight, or anothersuitable number). Processors 1310 may be any suitable processor capableof executing instructions. For example, in various embodimentsprocessors 1310 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x813, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 1310 may commonly,but not necessarily, implement the same ISA.

System memory 1320 may be configured to store camera control programinstructions 1322 and/or camera control data accessible by processor1310. In various embodiments, system memory 1320 may be implementedusing any suitable memory technology, such as static random accessmemory (SRAM), synchronous dynamic RAM (SDRAM), nonvolatile/Flash-typememory, or any other type of memory. In the illustrated embodiment,program instructions 1322 may be configured to implement a lens controlapplication 1324 incorporating any of the functionality described above.Additionally, existing camera control data 1332 of memory 1320 mayinclude any of the information or data structures described above. Insome embodiments, program instructions and/or data may be received, sentor stored upon different types of computer-accessible media or onsimilar media separate from system memory 1320 or computer system 1300.While computer system 1300 is described as implementing thefunctionality of functional blocks of previous Figures, any of thefunctionality described herein may be implemented via such a computersystem.

In one embodiment, I/O interface 1330 may be configured to coordinateI/O traffic between processor 1310, system memory 1320, and anyperipheral devices in the device, including network interface 1340 orother peripheral interfaces, such as input/output devices 1350. In someembodiments, I/O interface 1330 may perform any necessary protocol,timing or other data transformations to convert data signals from onecomponent (e.g., system memory 1320) into a format suitable for use byanother component (e.g., processor 1310). In some embodiments, I/Ointerface 1330 may include support for devices attached through varioustypes of peripheral buses, such as a variant of the Peripheral ComponentInterconnect (PCI) bus standard or the Universal Serial Bus (USB)standard, for example. In some embodiments, the function of I/Ointerface 1330 may be split into two or more separate components, suchas a north bridge and a south bridge, for example. Also, in someembodiments some or all of the functionality of I/O interface 1330, suchas an interface to system memory 1320, may be incorporated directly intoprocessor 1310.

Network interface 1340 may be configured to allow data to be exchangedbetween computer system 1300 and other devices attached to a network1385 (e.g., carrier or agent devices) or between nodes of computersystem 1300. Network 1385 may in various embodiments include one or morenetworks including but not limited to Local Area Networks (LANs) (e.g.,an Ethernet or corporate network), Wide Area Networks (WANs) (e.g., theInternet), wireless data networks, some other electronic data network,or some combination thereof. In various embodiments, network interface1340 may support communication via wired or wireless general datanetworks, such as any suitable type of Ethernet network, for example;via telecommunications/telephony networks such as analog voice networksor digital fiber communications networks; via storage area networks suchas Fibre Channel SANs, or via any other suitable type of network and/orprotocol.

Input/output devices 1350 may, in some embodiments, include one or moredisplay terminals, keyboards, keypads, touchpads, scanning devices,voice or optical recognition devices, or any other devices suitable forentering or accessing data by one or more computer systems 1300.Multiple input/output devices 1350 may be present in computer system1300 or may be distributed on various nodes of computer system 1300. Insome embodiments, similar input/output devices may be separate fromcomputer system 1300 and may interact with one or more nodes of computersystem 1300 through a wired or wireless connection, such as over networkinterface 1340.

As shown in FIG. 13, memory 1320 may include program instructions 1322,which may be processor-executable to implement any element or actiondescribed above. In one embodiment, the program instructions mayimplement the methods described above. In other embodiments, differentelements and data may be included. Note that data may include any dataor information described above.

Those skilled in the art will appreciate that computer system 1300 ismerely illustrative and is not intended to limit the scope ofembodiments. In particular, the computer system and devices may includeany combination of hardware or software that can perform the indicatedfunctions, including computers, network devices, Internet appliances,PDAs, wireless phones, pagers, etc. Computer system 1300 may also beconnected to other devices that are not illustrated, or instead mayoperate as a stand-alone system. In addition, the functionality providedby the illustrated components may in some embodiments be combined infewer components or distributed in additional components. Similarly, insome embodiments, the functionality of some of the illustratedcomponents may not be provided and/or other additional functionality maybe available.

Those skilled in the art will also appreciate that, while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 1300 may be transmitted to computer system1300 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link. Various embodiments mayfurther include receiving, sending or storing instructions and/or dataimplemented in accordance with the foregoing description upon acomputer-accessible medium. Generally speaking, a computer-accessiblemedium may include a non-transitory, computer-readable storage medium ormemory medium such as magnetic or optical media, e.g., disk orDVD/CD-ROM, volatile or non-volatile media such as RAM (e.g. SDRAM, DDR,RDRAM, SRAM, etc.), ROM, etc. In some embodiments, a computer-accessiblemedium may include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

The methods described herein may be implemented in software, hardware,or a combination thereof, in different embodiments. In addition, theorder of the blocks of the methods may be changed, and various elementsmay be added, reordered, combined, omitted, modified, etc. Variousmodifications and changes may be made as would be obvious to a personskilled in the art having the benefit of this disclosure. The variousembodiments described herein are meant to be illustrative and notlimiting. Many variations, modifications, additions, and improvementsare possible. Accordingly, plural instances may be provided forcomponents described herein as a single instance. Boundaries betweenvarious components, operations and data stores are somewhat arbitrary,and particular operations are illustrated in the context of specificillustrative configurations. Other allocations of functionality areenvisioned and may fall within the scope of claims that follow. Finally,structures and functionality presented as discrete components in theexample configurations may be implemented as a combined structure orcomponent. These and other variations, modifications, additions, andimprovements may fall within the scope of embodiments as defined in theclaims that follow.

What is claimed is:
 1. An apparatus, comprising: an optics assemblycomprising an optics component, wherein the optics assembly isconfigured to move within the apparatus on one or more axes orthogonalto an optical axis of the optics component the optics assembly issuspended by a plurality of wires on a base component of the apparatus,each wire being substantially parallel to the optical axis of the opticscomponent; one or more passive dampers disposed around the plurality ofwires, wherein the passive dampers are configured to passively dampenmotions of the optics assembly within the apparatus.
 2. The apparatus asrecited in claim 1, wherein the optics assembly includes a pocket, step,cavity, or indentation at each passive damper location that isconfigured to contain material of the passive damper duringdisplacement.
 3. The apparatus as recited in claim 2, wherein acomponent of the optics assembly includes a through-pipe cavity at eachpassive damper location that is configured to contain material of thepassive damper during displacement and allow passage of one of theplurality of wires.
 4. The apparatus as recited in claim 2, wherein acomponent of the optics assembly includes a u-shaped cavity indentationopen on one side and both ends at each passive damper location that isconfigured to contain material of the passive damper during displacementand allow passage of one of the plurality of wires.
 5. The apparatus asrecited in claim 1, wherein the optics assembly includes a magnet holderhaving a pocket, step, cavity, or indentation at each passive damperlocation that is configured to contain material of the passive damperduring displacement
 6. The apparatus as recited in claim 1, wherein theoptics assembly includes an optics holder having a pocket, step, cavity,or indentation at each passive damper location that is configured tocontain material of the passive damper during displacement
 7. Theapparatus as recited in claim 1, wherein the optics assembly includes acoil holder having a pocket, step, cavity, or indentation at eachpassive damper location that is configured to contain material of thepassive damper during displacement.
 8. The apparatus as recited in claim1, wherein the fixed component is a cover coupled to the base component.9. The apparatus as recited in claim 1, wherein the optics assemblyincludes a pocket, step, cavity, or indentation at each passive damperlocation that are configured to contain material of the passive damperduring displacement.
 10. The apparatus as recited in claim 1, whereineach passive damper is composed of a viscoelastic gel material thatcontacts an inner surface of the optics assembly and one of theplurality of wires to provide passive damping to motions of the opticsassembly within the apparatus.
 11. The apparatus as recited in claim 10,wherein the viscoelastic material is a silicon gel.
 12. The apparatus asrecited in claim 1, wherein the optics assembly further comprises anactuator component, wherein the actuator component is coupled to theoptics component by one or more springs that provide optical (Z) axismovement to the optics component relative to the actuator component, andwherein the passive dampers are disposed between an inner surface of theoptics assembly and one of the plurality of wires to provide passivedamping to motions of the optics assembly within the apparatus.
 13. Amethod, comprising: assembling a base assembly for an optical imagestabilization (OIS) voice coil motor (VCM) actuator module; assemblingan optics assembly for the OIS VCM actuator module, wherein the opticsassembly is configured to move within the actuator module on one or moreaxes orthogonal to an optical axis of an optics component suspending theoptics assembly by a plurality of wires connecting to the base assemblyof the actuator module, each wire being substantially parallel to theoptical axis of the optics component; and applying a passive dampingmaterial at one or more locations disposed around the plurality of wiressuspending the optics assembly, wherein the passive damping material isconfigured to apply passive damping to motions of the optics assemblywithin the OIS VCM actuator module.
 14. The method as recited in claim13, the applying the passive damping material at one or more locationsdisposed around the plurality of wires suspending the optics assemblyfurther comprises applying the passive damping material at one or morelocations, each of said locations comprising a step, cavity, orindentation at each passive damper location that is configured tocontain material of the passive damper during displacement.
 15. Themethod as recited in claim 13, wherein said applying a passive dampingmaterial at one or more locations on a top surface of the opticsassembly comprises: dispensing the passive damping material at the oneor more locations disposed around the plurality of wires; performing avertical automated optical inspection (AOI) to determine if the passivedamping material is properly positioned at the locations disposed aroundthe plurality of wires and to determine that the extent of the materialthat was dispensed at the locations is within pre-determined boundaries;curing the passive damping material that was deposited at the one ormore locations on the top surface of the optics assembly; and performingan automated optical inspection (AOI) profile scan to determine if thecured passive damping material at the one or more locations is within aheight H tolerance and within a diameter D tolerance.
 16. The method asrecited in claim 15, wherein the passive damping material is a silicongel, and wherein the curing is performed by application of ultraviolet(UV) light to the silicon gel.
 17. The method as recited in claim 13,wherein the optics assembly comprises an actuator magnet component andan optics component, wherein the actuator magnet component is coupled tothe optics component by one or more springs that provide optical (Z)axis movement to the optics component relative to the actuator magnetcomponent.
 18. A camera, comprising: a photosensor configured to capturelight projected onto a surface of the photosensor; an optics assemblyconfigured to refract light from an object field located in front of thecamera onto the photosensor; and an actuator module comprising: anoptical image stabilization (OIS) mechanism configured to move theoptics assembly within the actuator module on one or more axesorthogonal to an optical axis of the camera to stabilize an image planeformed by the optics assembly at the photosensor, wherein the opticsassembly is suspended by a plurality of wires on a base component of themechanism, each wire being substantially parallel to the optical axis ofthe optics component, and one or more passive dampers disposed aroundthe plurality of wires, wherein the passive dampers are configured topassively dampen motions of the optics assembly within the apparatus,wherein the passive dampers are configured to passively dampen movementsof the optics assembly by the OIS mechanism.
 19. The camera as recitedin claim 18, wherein the OIS mechanism is a voice coil motor (VCM)technology actuator.
 20. The camera as recited in claim 18, wherein eachpassive damper is composed of a viscoelastic gel material that contactsan inner surface of the optics assembly and one of the plurality ofwires to provide passive damping to motions of the optics assemblywithin the apparatus.